H262_ZL2

High Density Server - AMD EPYC™ 7003 - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA DLC
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Overview Specifications
  • Hardware-level root of trust support
  • Direct liquid cooling solution
  • 2U 4-node rear access server system
  • AMD EPYC™ 7003 Series processors
  • Dual processor per node, 7nm technology
  • 8 x LGA 4094 sockets
  • 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
  • 8 x 1Gb/s LAN ports (Intel® I350-AM2)
  • 4 x Dedicated management ports
  • 1 x CMC port
  • 24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
  • 4 x LP PCIe Gen4 x16 slots
  • 4 x OCP 3.0 Gen4 x16 slots
  • Dual 2200W (240V) 80 PLUS Platinum redundant power supply
Dimensions

4-Node - Rear access
440 x 87.5 x 840
Form Factor

2U
Motherboard

MZ62-HD4 Rev. 3.0
CPU

AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 280W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Compatible with AMD EPYC™ 7002 Series processors

Socket

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

Chipset

System on Chip
Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz

Network Connectivity

Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port

Video Output

Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP

Drive Bays / Storage

Per node:
6 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)

Total:
24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)

Expansion Slots

Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0

Total:
4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0

Management

Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage/Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
Security / TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system
Rear I/O

2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system
System Fans

4 x 80x80x38mm (16,300rpm)
Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

NOTE: System power supply requires C19 power cord
Operating Environment

Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Sas

N/A
Raid

N/A
Internal Io

Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Backplane Board

Speed and bandwidth: PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Os Compatibility

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later
Packaging Dimensions

1180 x 700 x 465 mm
Packaging Content

1 x H262-ZL2
4 x Liquid cooling kits
1 x 3-Section Rail Kit

Part Numbers

- Barebone package: 6NH262ZL2MR-00-1* - Motherboard: 9MZ62HD4NR-00 - 3-Section Rail kit: 25HB2-AN6103-K0R - Liquid cooling kit: 25ST7-200001-C4R (CPU, Memory, Mellanox MCX653106A-ECAT) - Backplane board - CBPH7O0: 9CBPH7O0NR-00 - Fan module: 25ST2-883828-D0R - Power Supply: 25EP0-222003-D0S
Optional Parts

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH262Z65SR-00-100
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NH262ZL2SR-RMA-A100
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