H262_PC0

High Density Server - 3rd Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS
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Overview Specifications
  • 2U 4-node rear access server system
  • Dual 3rd Gen Intel® Xeon® Scalable Processors per node
  • 8-Channel DDR4 RDIMM/LRDIMM, 64 x DIMMs
  • Supports Intel® Optane™ Persistent Memory 200 series
  • Dual ROM Architecture
  • 8 x 10Gb/s LAN ports via Intel® X710-AT2
  • 1 x CMC port
  • 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
  • 8 x LP PCIe Gen4 x16 slots
  • 4 x OCP 2.0 Gen3 x16 mezzanine slots
  • Dual 2200W 80 PLUS Platinum redundant power supply
Dimensions

4-Node - Rear access
440 x 87.5 x 840
Weight

Net Weight: 27.4 kg
Form Factor

2U
Motherboard

MH62-HD0
CPU

3rd Generation Intel® Xeon® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W

Please leave one PCIe slot empty if using processor with 270W TDP.

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4189

Total:
8 x LGA 4189

Socket P+

Chipset

Intel® C621A

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s

Network Connectivity

Per node:
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Total:
8 x 10Gb/s LAN ports (4 x Intel® X710-AT2)
Support NCSI function

4 x 10/100/1000 Mbps Management LAN
1 x CMC port
Video Output

Integrated in Aspeed® AST2500 x 4
4 x VGA ports
Drive Bays / Storage

Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

SAS card is required for SAS devices support

Expansion Slots

Per node:
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*, from CPU_0

Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0

Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0

4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*, from CPU_0

*Note: OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 Gen3 x16 bandwidth is needed.
Management

Aspeed® AST2500 Baseboard Management Controller
Aspeed® AST2520A2-GP Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
Security / TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system.

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system.
System Fans

8 x 80x80x38mm (16,300rpm)
Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note: The system power supply requires C19 power cord.

Operating Environment

Operating temperature: 10°C to 35°C*
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Sas

Depends on SAS add-in cards
Raid

Intel® SATA RAID 0/1
Internal Io

Per node:
1 x TPM header
1 x VROC connector
Backplane Board

Speed and bandwidth: PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Os Compatibility

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Windows Server 2016
Windows Server 2019
Windows Server 2022

Packaging Dimensions

1180 x 779 x 300 mm
Packaging Content

1 x H262-PC0
8 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers

- Barebone package: 6NH262PC0MR-00-1* - Motherboard: 9MH62HD0NR-00 - 3-Section Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-453214-M1R/25ST1-453215-M1R - Front panel board - CFPH004: 9CFPH004NR-00 - Backplane board - CBPH080: 9CBPH080NR-00 - Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R - Riser card - CRSH01D: 9CRSH01DNR-00 - Riser card - CRSH01E: 9CRSH01ENR-00 - LAN board - CLBH020: 9CLBH020NR-00 - Power supply: 25EP0-222003-D0S
Optional Parts

- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 riser card - CMTP16Z: 9CMTP16ZNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262PC0SR-RMA-A100
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