H262_NO0

HCI Server - 3rd Gen Intel® Xeon® Scalable - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS
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Overview Specifications
  • 2U 4-node rear access server system
  • 3rd Gen Intel® Xeon® Scalable Processors
  • Dual processor per node, 10nm technology
  • 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
  • Supports Intel® Optane™ Persistent Memory 200 series
  • Dual ROM Architecture
  • Intel® C621A Chipset
  • 8 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
  • 4 x Dedicated management ports
  • 1 x CMC port
  • 24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
  • 8 x LP PCIe Gen4 x16 slots
  • 4 x OCP 2.0 Gen3 x16 mezzanine slots
  • Dual 2200W 80 PLUS Platinum redundant power supply
Dimensions

4-Node - Rear access
440 x 87.5 x 840
Weight

Net Weight: 26.2 kg
Gross Weight: 49.34 kg
Form Factor

2U

Motherboard

MH62-HD1
CPU

3rd Generation Intel® Xeon® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket

Per Node:
2 x LGA 4189

Total:
8 x LGA 4189

Socket P+

Chipset

Intel® C621A Chipset
Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
Network Connectivity

Per node:
2 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 10GbE BASE-T LAN ports (4 x Intel® X710-AT2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port

Video Output

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP

Drive Bays / Storage

Per node:
6 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

Total:
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

SAS card is required for SAS devices support

Expansion Slots

Per node:
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*

Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*

*OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth.

Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP/AD/RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

Security / TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system
System Fans

8 x 80x80x38mm (16,300rpm)

Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

NOTE: The system power supply requires C19 power cord
Operating Environment

Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Please leave one PCIe slot empty if using processor with 270W TDP

Sas

Per node: 6 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1 Total: 24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1 SAS card is required for SAS devices support
Raid

Intel® SATA RAID 0/1/5/10
Internal Io

Per node:
1 x COM header
1 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Backplane Board

Speed and bandwidth: PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Os Compatibility

Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

Packaging Dimensions

1180 x 779 x 300 mm
Packaging Content

1 x H262-NO0
8 x CPU heatsinks
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH262NO0MR-00-1* - Motherboard: 9MH62HD1NR-00 - 3-Section Rail kit: 25HB2-A66122-K0R - CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R - Backplane board - CBPH7O0: 9CBPH7O0NR-00 - Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R - Power Supply: 25EP0-222003-D0S
Optional Parts

- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP16Z: 9CMTP16ZNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262NO0SR-RMA-A100
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