H262_Z66

High Density Server - AMD EPYC™ 7003/7002 - 2U-4 Node DP 24-Bay Gen3 NVMe/SATA/SAS
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Overview Specifications
  • 2U 4-node rear access server system
  • Dual AMD EPYC™ 7003/7002 Series Processors per node
  • 8-Channel DDR4 RDIMM/LRDIMM, 64 x DIMMs
  • 8 x 1Gb/s LAN ports via Intel® I350-AM2
  • 1 x CMC port
  • 12 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
  • 12 x 2.5" SATA/SAS hot-swappable bays
  • 8 x M.2 slots with PCIe Gen3 x4 interface
  • 8 x LP PCIe Gen4 x16 slots
  • 4 x OCP 2.0 Gen3 x16 mezzanine slots
  • Dual 2200W 80 PLUS Platinum redundant power supply

 

 

Dimensions

4-Node - Rear access
440 x 87.5 x 840

Weight

Net Weight: 47.63 kg
Gross Weight: 49.63 kg
Form Factor

2U

Motherboard

MZ62-HD0 Rev. 3.0
CPU

AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Dual processor per node, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 200W

Note:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
2) Contact GIGABYTE sales rep or technical support for more details about supporting cTDP 240W CPU.

Socket

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

Chipset

System on Chip
Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s

Network Connectivity

Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management port

Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function

4 x 10/100/1000 Mbps Management ports
1 x CMC port

Video Output

Integrated in Aspeed® AST2500
- 1 x VGA port per node
Drive Bays / Storage

Per node:
3 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
3 x 2.5" SATA/SAS hot-swappable bays

Total:
12 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
12 x 2.5" SATA/SAS hot-swappable bays

Expansion Slots

Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Total:
8 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0

4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Management

Aspeed® AST2500 Baseboard Management Controller
Aspeed® AST2520A2-GP Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

Security / TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
*1 x CMC port

*Only one CMC port per system.
System Fans

8 x 80x80x38mm (16,300rpm)
Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

Note: System power supply requires C19 power cord.
Operating Environment

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Sas

Depends on SAS add-in cards
Raid

N/A
Internal Io

Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Backplane Board

Speed and bandwidth: PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
Os Compatibility

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Packaging Dimensions

1180 x 779 x 300 mm
Packaging Content

1 x H262-Z66
8 x CPU heatsinks
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH262Z66MR-00-A* - Motherboard: 9MZ62HD0NR-00 - 3-Section Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R - Backplane board - CFPH004: 9CFPH004NR-00 - Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R - Power supply: 25EP0-222003-D0S
Optional Parts

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z66SR-RMA-A100
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