| Dimensions |
4-Node - Rear access
440 x 87.5 x 840 |
| Weight |
Net Weight: 47.63 kg
Gross Weight: 49.63 kg
|
| Form Factor |
2U |
| Motherboard |
MZ62-HD0 Rev. 3.0 |
| CPU |
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Dual processor per node, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 200W
Note:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
2) Contact GIGABYTE sales rep or technical support for more details about supporting cTDP 240W CPU.
|
| Socket |
Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
|
| Chipset |
System on Chip |
| Memory |
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
|
| Network Connectivity |
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x CMC port
|
| Video Output |
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP |
| Drive Bays / Storage |
Per node:
6 x 2.5" NVMe/SATA hot-swappable bays
Total:
24 x 2.5" NVMe/SATA hot-swappable bays
|
| Expansion Slots |
Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots, from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
8 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots, from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device |
| Management |
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
|
| Security / TPM |
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010 |
| Front I/O |
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
4 x Power button with LED
4 x ID button with LED
4 x Reset button
4 x System status LED
*1 x CMC status LED
*Only one CMC status LED per system. |
| Rear I/O |
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
*1 x CMC port
*Only one CMC port per system.
|
| System Fans |
8 x 80x80x38mm (16,300rpm) |
| Power Supply |
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note: System power supply requires C19 power cord. |
| Operating Environment |
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
|
| Sas |
N/A |
| Raid |
N/A |
| Internal Io |
Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
|
| Backplane Board |
Speed and bandwidth: PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s |
| Os Compatibility |
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.5 Update3
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0
VMware ESXi 8.0
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019 (x64)
Windows Server 2022 (x64)
|
| Packaging Dimensions |
1180 x 779 x 300 mm |
| Packaging Content |
1 x H262-Z62
8 x CPU heatsinks
1 x 3-Section Rail kit
|
| Part Numbers |
- Barebone package: 6NH262Z62MR-00-A* - Motherboard: 9MZ62HD0NR-00 - 3-Section Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R - Backplane board - CBPH0O4: 9CBPH0O4NR-00 - Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R - Power supply: 25EP0-222003-D0S |
| Optional Parts |
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z62SR-RMA-A100 |
