H263_S67-AAW1

High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 3000W
  • 2U 4-node rear access server system
  • Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
  • Dual Intel® Xeon® CPU Max Series per node
  • 8-Channel DDR5 RDIMM, 64 x DIMMs
  • Dual ROM Architecture
  • 1 x CMC port
  • 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
  • 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
  • 4 x LP PCIe Gen5 x16 slots
  • 4 x OCP 3.0 Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply
Dimensions

4-Node - Rear access
440 x 87.5 x 840

Form Factor

2U

Motherboard

MS63-HD1

CPU

5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 270W

Supports TDP up to 350W with no support on OCP slot at ambient 35°C.

Supports TDP up to 350W at ambient 30°C.

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4677

Total:
8 x LGA 4677

Socket E

Chipset

Intel® C741

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s

Network Connectivity

Per node:
1 x 10/100/1000 Mbps Management LAN

Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port

*Please refer to optional parts for ring topology support.

Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video Output

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP

Drive Bays / Storage

Per node:
2 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1

Total:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1

SAS card is required for SAS devices support

Expansion Slots

Per node:
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards

Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards

Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

Security / TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Rear I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port

*Only one CMC port per system.

System Fans

4 x 80x80x80mm (16,500rpm)

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

Note: The system power supply requires C19 power cord.

Operating Environment

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Sas

Depends on SAS add-in cards

Raid

Intel® SATA RAID 0/1/10/5

Internal Io

Per node:
1 x TPM header
1 x VROC connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system.

Backplane Board

Speed and bandwidth: PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Os Compatibility

Please refer to OS compatibility table in support page

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H263-S67-AAW1
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH263S67DR000ABW1* - Motherboard: 9MS63HD1UR-000 - 3-Section Rail kit: 25HB2-A66125-K0R - CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R - Front panel board - CFPH004: 9CFPH004NR-00 - Backplane board - CBPH081: 9CBPH081NR-00 - Fan module: 25ST2-888020-S1R - Riser card - CRSH01U: 9CRSH01UNR-00 - LAN board - CLBH010: 9CLBH010NR-00 - Power supply: 25EP0-230009-L0S

Optional Parts

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S67SR-RMA-A100